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Book Cover for: High Temperature Electronics Design for Aero Engine Controls and Health Monitoring, Stoica Lucian

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring

Stoica Lucian

There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems.

Technical topics presented in this book include:

  • High temperature electronics market
  • High temperature devices, materials and assembly processes
  • Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control
  • Future applications for high temperature electronics

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application.

High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.

Book Details

  • Publisher: River Publishers
  • Publish Date: Sep 30th, 2016
  • Pages: 160
  • Language: English
  • Edition: undefined - undefined
  • Dimensions: 9.21in - 6.14in - 0.44in - 0.89lb
  • EAN: 9788793379251
  • Categories: Electronics - Circuits - GeneralManufacturingAeronautics & Astronautics

About the Author

Lucian, Stoica: - Dr. Lucian Stoica (SM'14) received the B.Sc., M.S. degrees from Technical University of Iasi, Iasi, Romania, in 1999 and 2000, respectively. He received the Dr. Tech. degree from University of Oulu, Oulu, Finland in 2008. Since 2010, he is a Research Engineer and Project Leader with GE, Global Research, Munich, Germany. His main research interests are robust integrated circuits and systems for harsh environment applications. He has authored or co-authored over 15 publications in international journals or conferences, contributed to 1 book and 2 patents.
Steve, Riches: - "Steve Riches received a BA (Hons) in Natural Sciences from the University of Cambridge and has 16 years experience (1983-1999) in research and development at the Welding Institute (TWI) on interconnection and packaging of electronic devices and laser processing. Since 1999, he has had 16 years experience in business development at GE Aviation Systems - Newmarket. He has managed several UK DTI (TSB) collaborative projects and an EU Clean Sky project in last 3 years on high temperature electronics packaging involving several Universities, Institutes and Industrial Partners and presented regularly at high temperature electronics conferences in the USA and UK. He left GE Aviation in December 2015 and is now a director at Tribus-D Ltd, a start up company."
Colin, Johnston: - Dr. Colin Johnston is Director of commercial and industrial services for the Department of Materials, University of Oxford and manager of Oxford Materials Characterisation Service. Colin holds a senior research fellowship in the Department of Materials, University of Oxford where he is active in research and development of novel materials solutions for high temperature and high reliability electronics packaging and energy storage materials. Colin is co-chair of the HITEN and HiTEC international conferences on high temperature electronics. He has over 100 peer reviewed publications with an RG score of 35.56 and h-index of 23. Colin gained his Ph.D. in surface science and catalysis at Dundee Uni- versity in 1987. He then went on to work for AEA Technology for 14 years working in diverse areas of materials research and development. He has over 15 years experience in technology translation and exploitation of university research most recently through his leadership role in the Materials Knowledge Transfer Network.